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PEAK Matrix® Sep. 12, 2025
Procure-to-Pay (P2P) Products PEAK Matrix® Assessment 2025
Enterprises are recalibrating procurement and finance operations as cost pressures, regulatory complexity, and rapid technology advancements intensify. Procure-to-Pay (P2P) products have become integral to unifying purchasing and Accounts Payable (AP) workflows, enabling organizations to automate processes,… -
Thematic Report March 31, 2022
Engineering Services Outsourcing Handbook
The Engineering Research & Development (ER&D) industry is increasingly using the global sourcing ecosystem to meet the increasing talent requirements across the dynamic skills landscape. Engineering service providers have gained significance due to this changing enterprise… -
Thematic Report March 20, 2026
Engineering the Future: Global Hubs for Engineering Research and Development (ER&D) Services
Engineering services have become a strategic enterprise transformation enabler, driven by growing investments in digital engineering, software-defined products, AI, cybersecurity, cloud-native architectures, and sustainability-led innovation. Enterprises are increasingly embedding advanced technologies, such as generative AI, digital… -
AWS marketplace product and feature announcements at re:Invent 2025 mark a shift toward AI-powered procurement and solution-centric buying on its cloud marketplace platform with the launch of agent mode and AI-enhanced search, multi-product solutions, express private…
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Jaggaer’s product announcements at REV 2025 mark a strategic shift toward autonomous procurement, highlighted by the launch of Jaggaer AI (JAI), an AI assistant embedded across its source-to-pay suite. Designed to streamline workflows through contextual automation…
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PEAK Matrix® Sep. 23, 2025
Global Locations State of the Market 2025: Balancing Talent, Cost, and AI Disruption | Locations PEAK Matrix® 2025
Offshoring and nearshoring are gaining momentum as organizations seek to manage rising costs, margin pressures, and onshore talent constraints. This trend is expected to continue shaping global delivery strategies in the near future. Although APAC locations… -
NEWProvider Snapshot Oct. 30, 2026
Provider Snapshot | Cyient 2026
Everest Group’s Provider Snapshots provide comprehensive and fact-based overviews of leading providers across several dimensions, including financial performance, offerings, client base, delivery presence, and key developments. These reports are ideal references and starting points for enterprise… -
NEWProvider Snapshot Nov. 05, 2026
Provider Snapshot | L&T Technology Services (LTTS) 2026
Everest Group’s Provider Snapshots provide comprehensive and fact-based overviews of leading providers across several dimensions, including financial performance, offerings, client base, delivery presence, and key developments. These reports are ideal references and starting points for enterprise… -
Industrial AI is becoming an important transformation lever for manufacturers as automation programs grow more software-intensive, engineering talent remains constrained, and industrial firms seek to reduce manual effort across control logic, operator screens, device configuration, testing,…
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The report explores the transformation of enterprises and providers in the construction sector, focusing on aligning with emerging technologies and addressing dynamic industry challenges. It segments the industry into three primary areas: residential and commercial development,…
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Ivalua’s product announcements at Ivalua NOW 2026 reflect a strategic shift from embedded AI functionality toward a more extensible Source-to-Pay (S2P) platform enabled with agentic capabilities. With IVA serving as the front-end experience and IVA Studio…
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Viewpoint Jan. 10, 2025
Engineering R&D (ER&D) Outlook for 2025
In 2024, enterprises faced economic headwinds from recessionary pressures, inflation, high interest rates, and geopolitical tensions impacting supply chains. Despite these challenges, organizations showed resilience by focusing on cost control, value realization, and technology adoption to… -
Autonomous driving remains one of the most complex and capital-intensive transformation areas in the automotive industry, with Original Equipment Manufacturers (OEMs) continuing to face challenges related to safety validation, long-tail scenario coverage, and readiness for large-scale…
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Thematic Report Jan. 13, 2025
Supplier Risk Management Technology – Market Overview and Provider Landscape
Enterprises are increasingly adopting advanced tools for supplier risk management to gain greater visibility into risk factors, ensure compliance with regulatory standards, and proactively mitigate supplier-related risks. These technology tools, with their precision, efficiency, and responsiveness,… -
Thematic Report Sep. 02, 2025
Leading the Pack: Trends for the Top 200 Engineering Research and Development (ER&D) Enterprises 2025
In 2024, the ER&D market faced persistent inflationary pressures, geopolitical uncertainties, and supply chain realignments, prompting companies to index into more cautious and selective investment strategies. Despite the headwinds, enterprises spent on themes such as generative… -
Provider Snapshot Oct. 28, 2026
Provider Snapshot | Persistent Systems 2026
Everest Group’s Provider Snapshots provide comprehensive and fact-based overviews of leading providers across several dimensions, including financial performance, offerings, client base, delivery presence, and key developments. These reports are ideal references and starting points for enterprise… -
Tech Launch Perspective Dec. 24, 2025
B2B Marketplace – Review of Amazon Business’ Product Announcements at Amazon Business Reshape 2025
Amazon Business’ product announcements at Reshape 2025 reflect a strategic shift from a transactional platform to an AI-enabled B2B marketplace. With the introduction of tools such as Amazon Business Assistant and Savings Insights, the platform aims… -
Technology Application Deep Dive Dec. 02, 2025
Advanced Semiconductor Packaging: Innovations Enabling the Next Era of Compute Performance and Integration
Advanced semiconductor packaging encompasses a broad set of integration technologies, including wafer-level, 2.5D, 3D, panel-level, and embedded packaging, that enable high-density interconnects, reduced form factors, enhanced thermal performance, and heterogeneous system-level integration. As transistor scaling slows,… -
Enterprises are increasingly relying on providers due to the rapid pace of innovation in engineering. Capitalizing on this reliance, providers are developing offerings that can help them play a vital role in the product engineering value…
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Provider Snapshot Oct. 27, 2026
Provider Snapshot | LTM 2026
Everest Group’s Provider Snapshots provide comprehensive and fact-based overviews of leading providers across several dimensions, including financial performance, offerings, client base, delivery presence, and key developments. These reports are ideal references and starting points for enterprise…
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