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  • NEW
    Technology Awareness Deep Dive
    May 25, 2026

    This report examines the evolution of neoclouds as AI-first infrastructure platforms designed to support large-scale AI training, inference, and data-intensive workloads. It explores how growing AI demand is reshaping cloud infrastructure economics, pushing enterprises toward GPU-centric,…
  • Discovery
    March 17, 2026

    Discoveries focus on specific science and technology innovations that address today’s critical business issues and challenges. These brief yet detailed profiles highlight innovations across the world's leading companies, start-ups, universities, institutes, and the entire R&D ecosystem…
  • Discovery
    March 02, 2026

    Discoveries focus on specific science and technology innovations that address today’s critical business issues and challenges. These brief yet detailed profiles highlight innovations across the world's leading companies, start-ups, universities, institutes, and the entire R&D ecosystem…
  • Technology Application Deep Dive
    Dec. 02, 2025

    Advanced semiconductor packaging encompasses a broad set of integration technologies, including wafer-level, 2.5D, 3D, panel-level, and embedded packaging, that enable high-density interconnects, reduced form factors, enhanced thermal performance, and heterogeneous system-level integration. As transistor scaling slows,…
  • Discovery
    Aug. 29, 2025

    Discoveries focus on specific science and technology innovations that address today’s critical business issues and challenges. These brief yet detailed profiles highlight innovations across the world's leading companies, start-ups, universities, institutes, and the entire R&D ecosystem…
  • Thematic Report
    July 22, 2020

    In recent years, customer experience and digitalization of products and processes have taken centerstage in the engineering services domain. Enterprises continue to invest in emerging technologies such as AI, blockchain, and 5G and combine them with…