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  • Technology Application Deep Dive
    Dec. 02, 2025

    Advanced semiconductor packaging encompasses a broad set of integration technologies, including wafer-level, 2.5D, 3D, panel-level, and embedded packaging, that enable high-density interconnects, reduced form factors, enhanced thermal performance, and heterogeneous system-level integration. As transistor scaling slows,…
  • Discovery
    Aug. 29, 2025

    Discoveries focus on specific science and technology innovations that address today’s critical business issues and challenges. These brief yet detailed profiles highlight innovations across the world's leading companies, start-ups, universities, institutes, and the entire R&D ecosystem…
  • Mega Forces
    June 30, 2025

    With increasing complexities and rapid transformation across industries, business leaders must become adept at anticipating long-term, disruptive shifts to navigate an uncertain future confidently. Our Mega Forces framework – comprising themes including business models and value…
  • Event
    May 02, 2024

    As the second half of 2024 approaches, sourcing leaders are pivoting towards revenue acceleration strategies, moving beyond the traditional focus on cost savings. Procurement’s growing relevance within organizations underscores its necessity to adopt growth-oriented strategies, including…
  • Thematic Report
    May 02, 2024

    As the second half of 2024 approaches, sourcing leaders are pivoting towards revenue acceleration strategies, moving beyond the traditional focus on cost savings. Procurement’s growing relevance within organizations underscores its necessity to adopt growth-oriented strategies, including…
  • Thematic Report
    Oct. 27, 2020

    In recent years, engineering services has experienced steady growth across enterprise spend and global sourcing. Enterprises continue to invest in emerging technologies (such as AI, blockchain, nanotechnology, and 5G) and combine them with traditional engineering areas…