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  • Thematic Report
    March 31, 2022

    The Engineering Research & Development (ER&D) industry is increasingly using the global sourcing ecosystem to meet the increasing talent requirements across the dynamic skills landscape. Engineering service providers have gained significance due to this changing enterprise…
  • State of the Market
    Dec. 16, 2025

    5G is rapidly evolving as a foundational technology in the telecommunications and enterprise sectors, enabling ultra-low latency, high throughput, and massive device connectivity. It plays a key role in powering applications such as private networks, industrial…
  • State of the Market
    June 30, 2025

    The semiconductor industry remains the backbone of digital innovation, from AI and cloud computing to autonomous vehicles and next-generation mobility. After a volatile 2023, the industry rebounded selectively in 2024 with strong growth in high-performance computing,…
  • Thematic Report
    Nov. 19, 2025

    The global Engineering Research and Development (ER&D) services industry is fundamentally transforming, driven by macroeconomic pressures, regulatory shifts, and rapid advances in AI, IoT, and digital manufacturing. Enterprises are responding by rebalancing their engineering investments toward…
  • Thematic Report
    July 18, 2025

    The Middle East has evolved significantly over the past decade, with major strides in digital innovation, sustainability, and AI-infused projects. As nations seek to reduce their reliance on the oil and gas sector, they are actively…
  • Provider Compendium
    Nov. 04, 2025

    The shift toward value-based care, proactive population health management, and quality-linked reimbursement models is rapidly transforming the healthcare industry. Care management platforms have become foundational infrastructure, enabling organizations to manage chronic conditions, close care gaps, enhance…
  • State of the Market
    Dec. 24, 2024

    The report explores the transformation of enterprises and providers in the construction sector, focusing on aligning with emerging technologies and addressing dynamic industry challenges. It segments the industry into three primary areas: residential and commercial development,…
  • Viewpoint
    Jan. 10, 2025

    In 2024, enterprises faced economic headwinds from recessionary pressures, inflation, high interest rates, and geopolitical tensions impacting supply chains. Despite these challenges, organizations showed resilience by focusing on cost control, value realization, and technology adoption to…
  • PEAK Matrix®
    July 31, 2025

    The global capital markets operations landscape is rapidly advancing as institutions seek to serve a fast-growing pool of wealth, pension, and alternative asset investors while maintaining margin pressure and heightened regulatory scrutiny. Demand from asset and…
  • Thematic Report
    Oct. 30, 2024

    Enterprises are increasingly relying on providers due to the rapid pace of innovation in engineering. Capitalizing on this reliance, providers are developing offerings that can help them play a vital role in the product engineering value…
  • Provider Compendium
    Dec. 30, 2025

    Enterprises are experiencing rising data complexities as they scale cloud adoption, modernize data estates, and operationalize AI. In this landscape, undetected data issues, ranging from quality degradation and schema drift to pipeline failures and governance lapses,…
  • State of the Market
    Sep. 22, 2025

    Process mining software analyzes process-related information from event logs generated by ERP, CRM, and other enterprise systems to offer a fact-based approach to discover, monitor, and optimize as-is processes. It is a data-based approach to process…
  • PEAK Matrix®
    Sep. 23, 2025

    Offshoring and nearshoring are gaining momentum as organizations seek to manage rising costs, margin pressures, and onshore talent constraints. This trend is expected to continue shaping global delivery strategies in the near future. Although APAC locations…
  • Provider Compendium
    Oct. 15, 2025

    Digital Interaction Intelligence (DII) products are rapidly emerging as a core enabler in enterprise automation and transformation strategies. DII solutions adopt a user-centric lens to analyze digital activity, delivering more granular insights into how work actually…
  • Provider Recognition
    Sep. 03, 2024

    What is the Everest Group Engineering Services (ES) Top 50™? This report provides a clear and objective overview of the third-party services market and how ES providers compare to each other. It will assist enterprises in…
  • Provider Compendium
    Aug. 01, 2025

    Process mining drives operational excellence and facilitates enterprises’ digital transformation initiatives. By analyzing event logs from enterprise systems such as ERP and CRM, it offers a fact-based approach to discover, monitor, and optimize as-is processes. The…
  • Thematic Report
    Sep. 02, 2025

    In 2024, the ER&D market faced persistent inflationary pressures, geopolitical uncertainties, and supply chain realignments, prompting companies to index into more cautious and selective investment strategies. Despite the headwinds, enterprises spent on themes such as generative…
  • State of the Market
    Nov. 11, 2025

    Everest Group defines Digital Interaction Intelligence (DII) as an analytics product that offers a fact-based, technology-driven approach to understanding user interactions on various applications, particularly business applications. It captures user actions and metadata from multiple desktops…
  • PEAK Matrix®
    Oct. 30, 2024

    The increasing adoption of AI, internet of things, and 5G is significantly driving Engineering Research and Development (ER&D) investments in the semiconductor industry. Fueled by advances in semiconductor technologies, such as smaller node sizes, innovative materials,…
  • Technology Application Deep Dive
    Dec. 02, 2025

    Advanced semiconductor packaging encompasses a broad set of integration technologies, including wafer-level, 2.5D, 3D, panel-level, and embedded packaging, that enable high-density interconnects, reduced form factors, enhanced thermal performance, and heterogeneous system-level integration. As transistor scaling slows,…

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