Advanced Semiconductor Packaging: Innovations Enabling the Next Era of Compute Performance and Integration

Advanced semiconductor packaging encompasses a broad set of integration technologies, including wafer-level, 2.5D, 3D, panel-level, and embedded packaging, that enable high-density interconnects, reduced form factors, enhanced thermal performance, and heterogeneous system-level integration. As transistor scaling slows, packaging innovation has become a primary driver of performance improvement for AI accelerators, high-performance computing systems, automotive domain controllers, mobility devices, edge intelligence, and advanced networking platforms.

This report analyzes the advanced semiconductor packaging market, evaluating technology trends and readiness across major packaging formats, covering sub-technologies such as fan-out wafer-level packaging, fan-out panel-level packaging, active interposers, RDL interposers, embedded multichip modules, hybrid bonding, and monolithic 3D integration. We assess emerging imperatives, including ultrafine RDL scaling, material and substrate bottlenecks, thermal-aware design, and the rise of chiplet and domain-specific architectures.